A Guide to Electronics Packaging Design

Electronics packaging design is the production and enclosures of electronic devices ranging from microchips up to full on electronic systems. Since electronic products are considered fragile, the electronics product packaging design must consider protection from extreme temperatures, mechanical damage, electrostatic discharge and high frequency noise emission. However, it should also be as simple as possible as Apple has demonstrated.

The quality control team always sets high standards with respect to electronics packaging. In fact, some electronics manufacturing companies simply outsource from established electronic packaging companies who are already proven when it comes to creating custom electronic packaging. This solution will be helpful to the quality control team since they no longer have to worry about the electronic packaging aspect.


Fundamentals of Electronics Packaging

Electronic packaging is arguably the most complex among all levels of packaging as it requires extensive engineering and skill set in order to come up with an optimal overall electronics packaging design compared to other industry packaging designs. The wide range of options available makes it hard for the production team to decide since the choice may potentially conflict with the functions of the electronic packaging.

The choice should also be consistent with traditional packaging design practices and manufacturing capabilities. As electronic packaging is built and tested, it can be expected multiple revisions are inevitable. The electronic packaging design will continuously be rethought and revised until the final packaging design is achieved.


Functions of an Electronics Packaging Design

The electronic packaging design is a combination of minor electronic packages working altogether to achieve desires purpose. They are not only present to protect the PCB and electronic components from outside harm but also make sure they do not interrupt with the functions of these components. Unpacking is more and more seen as an experience.

Technological advancements also put a lot of pressure to electronic packaging companies because functions of the electronics packaging design evolve at a fast rate, keeping up with modern technology. The functions do not remain constant because as technology improves then the demands on electronic packaging also increases and change accordingly.

One of the foremost drivers in the electronics packaging industry is the fast pace evolution of the silicon IC technology. Another crucial driver is continuous photonics development which is automatically integrated to the various level of media interconnections relative to custom electronic packaging. These drivers force electronic product packaging designs to adapt and modify electronic packaging’s functions.

Speaking of photonic technologies, these electronic components are physically attached to the PCB elevating its design into an advanced form. Since they are physically interconnected with each other along with basic components of the system, this will stress pressure to the schematic design of electronics packaging.


Different Levels of Electronic Packaging

Electronics packaging design is organized in multiple levels namely Level 0 up to Level 5.

Level 0 – this electronic packaging level protects chips and semiconductors which are the simplest and most basic parts of an electronic system.

Level 1 – this electronic packaging level protects electronic components.

Level 2 – this electronic packaging level protects the printed circuit board.

Level 3 – this electronic packaging level protects assembly, wiring boards and associated components of these.

Level 4 – this electronic packaging level protects modules or collection of assemblies.

Level 5 – this electronic packaging level protects a combination of different modules or the electronic system in general.

These levels are necessary to help electronic manufacturing companies easily assess electronic packaging materials needed for an electronic packaging design. This makes operations more efficient and fluid since they can easily look for what they need simply by describing the electronic packaging level they are currently working on.


Electronics Packaging Design and Engineering

Creating custom electronics packaging designs are focused on achieving objectives by covering these following qualifications:

1. Interpretation of Specifications

Aside from the electrical circuits, the electronics packaging engineer should also be able to interpret the non-electrical concerns needed for the electronics packaging design. These non-electrical concerns are functionality, reliability, aesthetics, durability and production cost. Even if the electrical circuits are all in place yet the design failed any of these other concerns then the electronic product packaging design can still be considered failure to comply with standards.

2. Having a Design Approach

Even if the electronic packaging engineer is equipped with the right skills and knowledge to create the custom electronic packaging, he or she still has to have a design approach in place to do the job. The right product design approach is needed to meet the requirements set on the electronic packaging design.

3. Cost-Efficiency

If you are in the world of manufacturing, you should understand the importance of the ratio between cost and value. Having an electronic packaging design which is too expensive would offset its value even if it is fully-functional. The electronic design engineer must explore all options available with regards to electronic packaging foam and electronic packaging materials until the end result has a rational cost to value. Being cost-efficient is a key aspect of manufacturing not only in electronics. Product development with prototype companies can help.

4. Mechanical Knowledge

Most electronic design companies seek help from mechanical engineers and not only rely with electrical experts when it comes to custom electronic packaging. Their knowledge and expertise could make up for the non-circuitry areas of the project to make sure all aspects are covered.

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